Download e-book for iPad: Applied materials science : applications of engineering by Deborah D. L. Chung

By Deborah D. L. Chung

ISBN-10: 0849310733

ISBN-13: 9780849310737

Fabrics are the root of expertise. As such, such a lot universities offer engineering undergraduates with the basic options of fabrics technology, together with crystal buildings, imperfections, section diagrams, fabrics processing, and fabrics houses. Few, besides the fact that, provide the sensible, applications-oriented historical past that their scholars have to achieve industry.

Applied fabrics technological know-how: functions of Engineering fabrics in Structural, Electronics, Thermal, and different Industries fills that hole. From a cross-disciplinary point of view that displays either the multifunctionality of many fabrics and the vast scope commercial wishes, the writer examines the sensible functions of steel, ceramic, polymer, cement, carbon, and composite fabrics throughout a huge variety of industries. the subjects addressed comprise digital packaging, shrewdpermanent fabrics, thermal administration, nondestructive review, and fabrics improvement. The textual content is obvious, coherent, and educational widespread, contains a variety of updated references, and offers heritage fabric in a sequence of appendices.

Unique in its breadth of insurance of either fabrics and their purposes, utilized fabrics technology is either scientifically wealthy and technologically suitable. for those who paintings or educate those who aspire to paintings in an engineering skill, you'll find no textual content or reference that greater prepares its readers for real-world purposes of engineering fabrics.

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Extra resources for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries

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A thermoplast provides a reworkable joint, whereas a thermoset does not. Furthermore, a thermoplast is more ductile than a thermoset. Moreover, a solder suffers from its tendency to experience thermal fatigue due to the thermal expansion mismatch between the chip and the substrate, and the resulting work hardening and cracking of the solder. In addition, the footprint left by a solder tends to be larger than the footprint left by a polymer because of the ease with which the molten solder flows.

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Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries by Deborah D. L. Chung

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